https://doi.org/10.24928/2018/0475

‘Site Layout Planning Waste’ Typology and Its Handling Through AR-BIM Concept: A Lean Approach

Abhishek Raj Singh1 & Venkata Santosh Kumar Delhi2

1Ph.D. Scholar, Department of Civil Engineering, Indian Institute of Technology Bombay, India, [email protected]
2Assistant Professor, Department of Civil Engineering, Indian Institute of Technology Bombay, India, [email protected]

Abstract

Site layout planning (SLP) aims at the efficient placement of temporary facilities on a construction site. Improper planning can lead to tremendous wastes in terms of unnecessary transport of materials and other resources around the site. A plethora of research has presented SLP as an optimization problem, but a few have focused on the wastes involved and that occur due to an improper layout of the construction site. To develop the ‘SLP waste’ typology, a comprehensive literature review was done, and the experts of SLP were interviewed. The identified wastes were found to be resulting due to inefficient layouts, improper coordination and collaboration among the project stakeholders and conflict of their interest. The interviewed experts highlighted the inefficiency of two-dimensional (2D) drawings and requirement of three-dimensional (3D) visualization that can aid in envisioning the future site scenarios. Therefore, utilizing Augmented Reality (AR) integrated Building Information Modeling (BIM), a conceptual tool ‘AR-BIM’ is proposed, and the anticipated working is briefed out in this study. The tool is under development and is expected to ease out the planning of site layouts and will aid in enabling lean, along with value generation in construction projects.

Keywords

Lean Construction Sites, Site Layout Planning, Team Collaboration, Waste Elimination

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Reference

Singh, A. R. & Delhi, V. S. K. 2018. ‘Site Layout Planning Waste’ Typology and Its Handling Through AR-BIM Concept: A Lean Approach, 26th Annual Conference of the International Group for Lean Construction , 123-133. doi.org/10.24928/2018/0475

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